The IConnPS MEM TM PLUS is built on the successful and industry leading IConnPSPLUS wire bonder platform, with newly developed hardware and process capabilities to improve throughput and yield, targets the growing complexities of stacked-die memory applications. Designed for performance, the IConnPS MEM TM PLUS is positioned to increase productivity and achieve the best cost of ownership by leveraging the latest process technology for bonding with silver, in addition to gold wire.
The standard IConnPS MEM TM PLUS comes with a large 80mm bondable area as standard. Increased bondable area upgrades to 87mm with IConnPS MEM TM PLUS LA, and to 90mm with IConnPS MEM TM PLUS ELA are also available.
The Company is currently engaged in evaluations with many major memory customers and OSATs. Please contact your local sales and service representative for more information.
About Kulicke & Soffa
Caution Concerning Results and Forward Looking Statements
In addition to historical statements, this press release contains statements relating to future events and our future results. These statements are "forward-looking" statements within the meaning of the Private Securities Litigation Reform Act of 1995, and include, but are not limited to, statements that relate to our future revenue, sustained, increasing, continuing or strengthening demand for our products, the continuing transition from gold to copper wire bonding, replacement demand, our research and development efforts, our ability to identify and realize new growth opportunities and our ability to control costs. While these forward-looking statements represent our judgments and future expectations concerning our business, a number of risks, uncertainties and other important factors could cause actual developments and results to differ materially from our expectations. These factors include, but are not limited to: the risk that customer orders already received may be postponed or canceled, generally without charges; the risk that anticipated customer orders may not materialize; the risk that our suppliers may not be able to meet our demands on a timely basis; the volatility in the demand for semiconductors and our products and services; a substantial completion of transition from gold to copper wire bonding by the industry, volatile global economic conditions, which could result in, among other things, sharply lower demand for products containing semiconductors and for the Company's products, and disruption of capital and credit markets; the risk of failure to successfully manage our operations; acts of terrorism and violence; risks, such as changes in trade regulations, currency fluctuations, political instability and war, which may be associated with a substantial non-
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Kulicke & Soffa Industries, Inc.
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