Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa",
"K&S" or the "Company"), announced today that it will be showcasing
newly launched equipment and market leading packaging solutions at the
SEMICON West 2016 trade show in San Francisco, California, from July 12
to 14, 2016.
Continuing with the successful launch of the AsterionTM wedge
bonder, K&S will be introducing the AsterionTM EV
- an extended version of the wedge bonder which is built on a new
architecture with enhanced capability to handle a multitude of
The AsterionTM EV offers an expanded
bond area with new robust pattern recognition capabilities and extremely
tight process controls for advanced interconnect materials. These
advanced features deliver heightened productivity, bonding quality and
reliability. The enlarged bondable area enhances flexibility and reduces
factory line integration costs.
In addition, K&S will be featuring the new TPR (Twin Placement
Robot), which brings the placement accuracy of the Hybrid to 7µm.
The Hybrid is a multi-application solution for advanced packaging, ideal
for wafer level packaging, Fan-Out Wafer Level Packaging (FOWLP),
System-in-Package (SiP), Multi-Chip Module (MCM), flip-chip, modules and
embedded components. It is highly capable of placing both active and
passive components, achieving a throughput up to 27 kUPH for Flip Chips
plus 48 kUPH for passives with a single machine.
Chan Pin Chong, Kulicke & Soffa's Vice President for the Wedge Bonders,
Capillaries and Blades Business Lines, said, "K&S is continuing to
partner with customers in different application spaces to develop
innovative offerings of latest products and solutions. These technical
solutions further strengthen our position as a comprehensive solution
provider to the market."
Customers can view these technical solutions at the SEMICON West 2016
trade show in San Francisco, California, Booth #6060 from July 12-14,
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and
manufacture of semiconductor, LED and electronic assembly equipment. As
a pioneer in this industry, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, advanced SMT, wedge
bonding and a broader range of expendable tools to its core ball bonding
products. Combined with its extensive expertise in process technology,
K&S is well positioned to help customers meet the challenges of
assembling the next-generation semiconductor and LED devices. (www.kns.com)
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Kulicke & Soffa Industries, Inc.
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Source: Kulicke & Soffa Industries, Inc.
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