The new ULTRALUX™ automatic wire bonder along with the POWER-C™ wedge bonder will debut at the trade show. The ULTRALUX™ wire bonder utilizes the latest technologies and material which offers cost-of-ownership advantage, delivering high productivity and yield. Its quick LED suite ensures time to market optimization with quick bond, stitch and loop processes.
K&S’s new POWER-C™ wedge bonder is built specifically for single-row TO package power devices. The bonder is engineered with a proven and powerful direct-drive motion system, bondhead, ultrasonic generator system and wire feeding mechanism. Its expanded pattern recognition capabilities deliver industry leading productivity and reliability. Other K&S solutions such as the RAPID™ Pro GEN-S series ball bonder, capillaries and dicing blades will also be showcased.
Customers can see the full assembly of solutions at the SEMICON China trade show in
About Kulicke & Soffa
Leveraging decades of development proficiency and extensive process technology expertise, Kulicke & Soffa’s expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly. Dedicated to empowering technological discovery, always, K&S collaborates with customers and technology partners to push the boundaries of possibility, enabling a smarter future (www.kns.com).
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