Kulicke & Soffa will be showcasing the RAPID™ MEM, Gen-S Series of automatic wire bonder engineered to enable Industry 4.0 communication and is RoHS compliant. Its advanced process features such as real-time monitoring and diagnostics capabilities ensures quality and efficient assembly serving high-performance and high-reliability semiconductor applications.
In addition to the RAPID™ MEM wire bonder, the Company will also be demonstrating its Industry 4.0 connectivity software solutions – KNet PLUS and Auto OLP 2019 (auto offline programming). These solutions have been successfully deployed and implemented at customer sites globally to enhance quality, improve productivity and manage machine performance. Also, a 3D overview of the Liteq 500 projection stepper’s unique architecture and features will be available along with an augmented reality demonstration that highlights the ease and flexibility of the Asterion wedge bonder’s bond tool change-over capabilities.
Customers could visit K&S’s booth #M0640/ 4Fin Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1) to discuss more on their technological needs.
About Kulicke & Soffa
Leveraging decades of development proficiency and extensive process technology expertise, Kulicke & Soffa’s expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly. Dedicated to empowering technological discovery, always, K&S collaborates with customers and technology partners to push the boundaries of possibility, enabling a smarter future (www.kns.com).
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Kulicke & Soffa Industries, Inc.
Marilyn Sim
Public Relations
P: +65-6880-9309
F: +65-6880-9580
msim@kns.com
Kulicke & Soffa Industries, Inc.
Joseph Elgindy
Investor Relations & Strategic Initiatives
P: +1-215-784-7500
F: +1-215-784-6180
investor@kns.com