Kulicke & Soffa will be showcasing its latest offering of solutions at the SEMICON Taiwan 2018 trade show, Taipei Nangang Exhibition Center, Level 4 Booth #M540.
- Asterion™EV -Built on an architecture delivering enhanced capability to address the industry’s growing and changing wedge bonding applications. This single platform can handle a multitude of interconnect materials such as large aluminum wire, ribbon and interconnects for battery cells.
- RAPID™ MEM – Delivers advanced process capabilities, real-time monitoring and diagnostics to ensure the highest quality and efficient assembly of memory and other high performance semiconductor packages.
- ConnX™ Elite with RPM features – Real-time monitoring and diagnostics further enhances the ConnX Elite value proposition and ensures the best quality and most efficient assembly of low-pin count, high-reliability semiconductor applications.
- iStack™W+ – Addressing the emerging trend of attaching thinner die and substrates, the iStack™ W+ also provides a solution for wafer-level die attach.
In addition, a wide range of consumables products such as a new generation of hub blades for silicon wafer dicing (discrete, logic IC and LCD driver); heavy copper and aluminum wire bonding wedges for discrete components, power and hybrid modules; as well as new capillary designed specifically for low-pin count packaging applications will also be showcased.
About Kulicke & Soffa
Kulicke & Soffa Industries, Inc.
Investor Relations & Strategic Initiatives