Kulicke & Soffa will be showcasing its latest GEN-S high performance wire bonder, RAPID™ Pro. This new platform delivers advanced process capabilities to improve production processes supporting smart manufacturing. Real-time process monitoring, equipment health monitoring, diagnostics and traceability ensure the highest quality and efficient assembly of automotive and high performance semiconductor packages.
In addition, K&S will also be featuring the Asterion™EV wedge bonder and the iFlex T2 electronics assembly machine. The Asterion™EV is built on an architecture with enhanced capability to address the industry’s growing and changing applications needs. This single platform can handle a multitude of interconnect materials such as large aluminum wire, PowerRibbon™ and interconnects for battery cells. The iFlex T2 is designed with anincreased feeder capacity of 25% and excels at multi-part tray feeding. This multifunctional flexibility makes it a perfect standalone or end-of-line solution for the most demanding, high-mix applications.
Customers can view these technical solutions at the SEMICON West 2018 trade show, North Hall, Booth #6052.
About Kulicke & Soffa
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Source:
Kulicke & Soffa Industries, Inc.
Marilyn Sim, +65-6880-9309
Public Relations
F: +65-6880-9580
msim@kns.com
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Joseph Elgindy, +1-215-784-7500
Investor Relations & Strategic Initiatives
F: +1-215-784-6180
investor@kns.com