Kulicke & Soffa will be at the SEMICON Korea trade show booth C400 Hall C, showcasing its latest equipment.
- RAPID™ Pro – the first in the latest GEN-S high performance wire bonders series, RAPID™ Pro delivers advanced process capabilities, real-time monitoring, diagnostics and traceability to ensure the highest quality and efficient assembly of automotive as well as other high performance semiconductor packages.
- AsterionTM – built on an architecture with enhanced capabilities addresses the industry's growing and evolving power control and storage needs. A single platform handles a multitude of interconnect materials such as large aluminum wire, PowerRibbon™ and interconnects for battery cells.
- Hybrid Wafer Feeder – an innovative solution that enables the combination of ultra-high-speed passive and active placement with high-accuracy flip-chip bonding directly from wafer is ideal for high-volume System-in-Package (SiP), flip-chip, die-attach and wafer-level-package manufacturing. Placement accuracy up to 7µm @ 3 sigma, provides a compelling alternative to existing commercial solutions.
“The latest Rapid™ Pro is the first GEN-S Series ofbonder with the capabilities to deliver high yield and enable machine-to-machine communication. Kulicke & Soffa continues driving research and development investments delivering value-added features supporting the smart-manufacturing technology and improving the operational efficiency of customers,” said
K&S consumable products including Quantis™ QFN and TeraCap™ capillaries, as well as FCC™ Plus and OptoTM Plus dicing blades, will also be featured at the trade show.
About Kulicke & Soffa
Kulicke & Soffa Industries, Inc.
Investor Relations & Strategic Initiatives