Kulicke & Soffa will introduce its upcoming GEN-S Series of ball bonding solutions and will also showcase several other leading solutions serving the growing Automotive, Industrial and Advanced Packaging markets.
- RAPIDTM Pro - the first in the new GEN-S (Smart Generation) Series of high performance ball bonders. RAPIDTM Pro introduces advanced process capabilities, real-time monitoring and diagnostics to ensuring the highest quality and efficient assembly serving automotive applications in addition to high-performance, high-reliability semiconductor applications.
"Our latest GEN-S series highlights our continuous focus on research and development to deliver value-added solutions with unparalleled performance to our customers," stated
Nelson Wong, Kulicke & Soffa's Vice President of Ball Bonder Business Line & Strategic Solutions Development.
- AsterionTM - enhanced capability hybrid wedge bonder. It offers an expanded bond area with robust pattern recognition capabilities and extremely tight process controls for advanced interconnect materials.
- ATPremierTM PLUS - the versatile wafer level bonder with the smallest footprint that delivers superior wafer-level stud bumping and high productivity with increased efficiency.
- Hybrid with Horizontal Wafer Feeder - an innovative solution that enables the combination of ultra-high-speed passive and active placement with high-accuracy flip-chip bonding directly from wafer, ideal for high-volume System-in-Package (SiP), flip-chip, die-attach and wafer-level-package manufacturing. Placement accuracy up to 7µm @ 3 sigma, provides a compelling alternative to existing commercial solutions.
The Company will be demonstrating these products at booth number 540 on level 4 of the Taipei Nangang Exhibition Center.
About Kulicke & Soffa
Kulicke & Soffa Industries, Inc.
Investor Relations & Strategic Initiatives