VELDHOVEN,
The iFlex T2 and H1 systems offer best in class flexibility, fast changeover and the lowest defect per million (DPM) rates in the industry. These advanced solutions can place all types of passive and discrete SMT components and also handle multifunctional and end-of-line placements.
The Hybrid 3 is an advanced packaging solution that combines the lowest DPM with the highest accuracy. It achieves a placement accuracy of less than 10 µm, making it ideal for wafer level packaging, SiP, MCM, flip-chip modules and embedded components. Having evolved from the high speed AX/iX product family, the Hybrid 3 is also fully capable of placing traditional SMT components at volume.
All the machines at the exhibition include a standard list of advanced features, such as Constant Component Monitoring and Active Closed-loop Placement Force Control. They are also easily integrated into factory processes using Assembléon's advanced software solutions. As with all Assembléon equipment, they are supported by an award-winning customer support organization.
Assembléon recently became part of Kulicke & Soffa (K&S), a global leader in the design and manufacture of semiconductor and LED assembly equipment. Assembléon's solutions are a perfect fit for K&S, extending the company's equipment portfolio of advanced packaging while also diversifying into the industrial, medical, and automotive markets with advanced SMT.
"As part of K&S, we are continuing to focus on optimizing the pick & place process," said
Assembléon leads the industry with its high placement quality and unique assembly solutions that offer a defect rate below 1 part per million placements. At APEX, visitors can see the iFlex T2, iFlex H1 and Hybrid 3 machines at the Assembléon stand in Hall D booth 915.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, advanced SMT, wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. (www.kns.com)
Kulicke & Soffa Industries, Inc.
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Kulicke & Soffa Industries, Inc.
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