The QuantisTM QFN Capillary combines the extensive K&S copper applications experience with the innovatively engineered geometrical designs produced to handle the toughest process challenges on a variety of QFN carriers. Features include excellent bond quality control, process portability and response consistency, and improved cost of ownership (CoO). High precision ceramics manufacturing, advanced quality management practices, and advanced wire bonding knowledge, all together enable K&S to offer QuantisTM products with higher resistance to common life limiting factors in copper wire bonding.
Chan Pin Chong, Kulicke & Soffa's Vice President of the Wedge Bonder, Capillaries and Blades Business Lines, remarked, "The QuantisTM QFN offers lower cost of ownership due to its highly stable bond quality and consistent usable life. It is now used in production at a leading packaging manufacturer and we expect continued success."
The QuantisTM Family will serve the modern advanced copper wire bonding processes, offering superior precision, improved stability and CoO. The QuantisTM QFN is the first in this family of copper wire bonding products to be launched.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor and LED assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. (www.kns.com)
Kulicke & Soffa Industries, Inc.
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