SINGAPORE--(BUSINESS WIRE)--

Kulicke & Soffa Industries, Inc. (KLIC) ("K&S" or the "Company") today announced the appointment of Irene Lee to the role of Chief Quality Officer. Ms. Lee will report to the President and Chief Executive Officer, Bruno Guilmart. She will be responsible for overseeing the quality assurance function across the Company's global organization.

Ms. Lee is a technology industry veteran with more than 30 years of engineering and quality control experience. She joins K&S from Seagate Technology International Inc. where she held various operations, engineering, and quality-related positions over a 24 year career. In her last role at Seagate Technology, Ms. Lee was responsible for overall factory quality and product reliability engineering for Asia, and managed a staff of over 1000. Prior to Seagate Technology, she was a design engineer at Hughes Offshore Group Ltd. Ms. Lee received an Advanced Diploma in Mechanical Engineering from Singapore Polytechnic, and a Master's of Business Administration from the University of Leeds.

Ms. Lee said, "I am delighted to join K&S and I look forward to working with the management team in meeting and exceeding the current and future quality requirements of our customers."

Bruno Guilmart, Kulicke & Soffa's President and Chief Executive Officer, remarked, "K&S plays a critical role in the semiconductor industry, with quality and reliability of our products being the highest importance. We are pleased to have Irene join us given her extensive experience and proven track record of driving an organization to achieve world class standards. Having Irene lead quality initiatives across all areas of our business will allow us to set a higher bar with the industry for unparalleled quality in serving our customers."

About Kulicke & Soffa

Kulicke & Soffa (KLIC) is a global leader in the design and manufacture of semiconductor and LED assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions, adding die and wedge bonders and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. (www.kns.com)