FORT WASHINGTON, Pa. --(BUSINESS WIRE)--Mar. 30, 2009-- Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) today announced the formal launch of ConnX-VLEDPSTM automatic ball bonder—an extension of the company’s leading ConnXPSTM ball bonder designed specifically for vertical LED applications. Devices bonded with a vertical orientation of the lead frame include high brightness and high-power LED lamps, and represent a growing portion of the overall LED market. With the launch of ConnX-VLED, Kulicke & Soffa now offers an excellent cost/performance bonding solution for the entire spectrum of LED applications.
ConnX-VLED offers all of the same advantages over competitive products as its namesake, including accuracy to +/- 3.0 μm, automatic recovery paths for common production stoppages, programmable back-up power and many others that make ConnX the technology leader in its class. ConnX-VLED joins iStackPSTM, ICONNPSTM and ConnX in Kulicke & Soffa’s Power Series platform, the next generation of semiconductor assembly equipment for today’s most challenging applications. Driven by the most powerful X-Y-Z motion control system available on the market, Power Series products deliver the highest levels of speed, accuracy and throughput for reduced cost of ownership.
Commenting on the announcement,
ConnX-VLED made its debut at SEMICON China 2009, held at the Shanghai New International Expo Centre
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Caution Concerning Forward Looking Statements
In addition to historical statements, this press release contains statements relating to future events and our future results. These statements are “forward-looking” statements within the meaning of the Private Securities Litigation Reform Act of 1995, and include, but are not limited to, statements that relate to the strength and growth of the LED market, future demand for our products, and benefits to our customers from our products and services. While these forward-looking statements represent our judgments and future expectations concerning our business, a number of risks, uncertainties and other important factors could cause actual developments and results to differ materially from our expectations. These factors include, but are not limited to: successful launch and market acceptance of the ConnX-VLED wire bonding platform; deteriorating global economic conditions, resulting in, among other things, sharply lower demand for products containing semiconductors and for the Company’s products; the risk of failure to successfully manage our operations; the risk that anticipated customer orders may not materialize or that orders received may be postponed or canceled, generally without charges; the volatility in the demand for semiconductors and our products and services; the risk that we may not be able to develop and manufacture new products and product enhancements on a timely and cost effective basis; acts of terrorism and violence; risks, such as changes in trade regulations, currency fluctuations, political instability and war, associated with a substantial foreign customer and supplier base and substantial foreign manufacturing operations; and the factors listed or discussed in
Source:
FD
Geoff Grande, CFA
P: (617) 747-1721
F: (617) 747-1711
geoff.grande@fd.com
or
Kulicke & Soffa
Tom Johnson
Director – Investor Relations & Corporate Communications
P: (215) 784-6411
F: (215) 784-6167
tjohnson@kns.com