Kulicke & Soffa to Participate and Host Technical Seminar at SEMICON Taiwan 2016
Kulicke & Soffa will be showcasing its market leading packaging solutions at Taipei Nangang Exhibition Center, 4F, Booth Number 430.
- AsterionTM EV, an extended version of the Asterion wedge bonder built on a new architecture with enhanced capability to handle a multitude of interconnect materials. It offers an expanded bond area with new robust pattern recognition capabilities and extremely tight process controls for advanced interconnect materials. These advanced features deliver heightened productivity, bonding quality and reliability. The enlarged bondable area enhances flexibility and productivity, directly benefiting cost of ownership.
Hybrid, a multi-application solution for advanced packaging,
ideal for wafer level packaging,
Fan-Out Wafer Level Packaging(FOWLP), System-in-Package (SiP), Multi-Chip Module (MCM), flip-chip, modules and embedded components. With the Hybrid's new TPR (Twin Placement Robot), the placement accuracy has improved to 7µm. It is highly capable of placing both active and passive components, achieving a throughput up to 27K UPH for Flip Chips plus 48K UPH for passives with a single machine.
IConnPS MEM PLUSTM,
a high performance Memory bonder for
Gold and Silveralloy wire bonding. With its advanced process, looping overhang and ease of use capabilities, it delivers high quality and productivity benefits in complex multistack package applications.
- AT PremierPS PLUSTM, a versatile wafer level bonder for wire bonding and stud bumping applications. It delivers high productivity and increased efficiency with its low temperature gold stud-bumping capabilities.
Kulicke & Soffa will be holding a technical seminar during the SEMICON
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