Kulicke & Soffa to Participate at SEMICON China 2017
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa",
"K&S" or the "Company"), announced today that it will be exhibiting at
the SEMICON China 2017 trade show in Shanghai, China, from March 14 to
Kulicke & Soffa will be launching its new assembly and packaging
solutions at Shanghai New International Expo Centre, Hall W4, Booth
ConnXPS ELITETM, latest
high speed wire bonder for discrete and low pin count packages. Its
enhanced motion control systems and Quick SuiteTM processes
deliver maximum productivity and simplified process optimization.
AsterionTM EVC (Extended Version C),
an extended version of the Asterion wedge bonder, with a bondable area
of 300mm X 860mm, is built on a reengineered architecture with
enhanced capability to handle a multitude of interconnect materials.
The enlarged bondable area enhances flexibility and productivity for
Battery Bonding, directly benefiting cost of ownership.
AsterionTM C, a hybrid wedge bonder
with enhanced capabilities that includes an expanded bond area, new
robust pattern recognition capabilities and extremely tight process
controls. If offers a large bondable area of 300mm X 300mm which
reduces indexing time while improving MTBA
(Mean-Time-Between-Assists). These advanced features deliver
heightened productivity, bonding quality and reliability.
APAMATM DA (Die Attach), latest
high performance and productivity die attach bonder for single or
stack die bonding. This next generation platform delivers industry
leading throughput and best-in-class yields by leveraging on the
unique advances in functionality.
FCC™ Plus, latest hub blades designed to fulfill the
growing process requirement in the advanced packaging, flip chip and
WLP wafer dicing markets. With the add-on features such as vibration
control for high RPM application and anti-corrosion for acidic coolant
environment, it delivers superior cut quality and useful life to drive
accuracy reducing cost of ownership.
OptoTM Plus, enhanced blades for LED
package singulation, with new features such as vibration control for
high RPM application, optional small hub design to reduce blade
loading, and special slit option to enhance blade cooling and
facilitate debris removal.
Other leading packaging solutions such as the IConnPS
MEM PLUSTM high performance bonder for memory
devices, Hybrid multi-application equipment for advanced
packaging and iFlex T2 multifunction equipment which is
ideal for an Electronics Assembly production line will also be featured
at the K&S booth.
"The semiconductor market continues to evolve rapidly, with increasing
demand in solutions to meet the assembly and packaging technologies. K&S
looks forward to showcasing and sharing our latest leading packaging
solutions to meet the industry's growing demand and challenges," said
Yih-Neng Lee, Kulicke & Soffa's Senior Vice President of Global Sales
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor
packaging and electronic assembly solutions supporting the global
automotive, consumer, communications, computing and industrial segments.
As a pioneer in the semiconductor space, K&S has provided customers with
market leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, electronics assembly,
wedge bonding and a broader range of expendable tools to its core
offerings. Combined with its extensive expertise in process technology
and focus on development, K&S is well positioned to help customers meet
the challenges of packaging and assembling the next-generation of
electronic devices. (www.kns.com)
View source version on businesswire.com: http://www.businesswire.com/news/home/20170310005033/en/
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Source: Kulicke & Soffa Industries, Inc.
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