Kulicke & Soffa to Participate and Host Technical Seminar at SEMICON Taiwan 2016
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa",
"K&S" or the "Company"), announced today that it will be exhibiting at
the SEMICON Taiwan 2016 trade show in Taipei, Taiwan, from September 7
to 9, 2016.
Kulicke & Soffa will be showcasing its market leading packaging
solutions at Taipei Nangang Exhibition Center, 4F, Booth Number 430.
AsterionTM EV, an extended version of
the Asterion wedge bonder built on a new architecture with enhanced
capability to handle a multitude of interconnect materials. It offers
an expanded bond area with new robust pattern recognition capabilities
and extremely tight process controls for advanced interconnect
materials. These advanced features deliver heightened productivity,
bonding quality and reliability. The enlarged bondable area enhances
flexibility and productivity, directly benefiting cost of ownership.
Hybrid, a multi-application solution for advanced packaging,
ideal for wafer level packaging, Fan-Out Wafer Level Packaging
(FOWLP), System-in-Package (SiP), Multi-Chip Module (MCM), flip-chip,
modules and embedded components. With the Hybrid's new TPR (Twin
Placement Robot), the placement accuracy has improved to 7µm. It
is highly capable of placing both active and passive components,
achieving a throughput up to 27K UPH for Flip Chips plus 48K UPH for
passives with a single machine.
IConnPS MEM PLUSTM,
a high performance Memory bonder for Gold and Silver alloy wire
bonding. With its advanced process, looping overhang and ease of use
capabilities, it delivers high quality and productivity benefits in
complex multistack package applications.
AT PremierPS PLUSTM,
a versatile wafer level bonder for wire bonding and stud
bumping applications. It delivers high productivity and increased
efficiency with its low temperature gold stud-bumping capabilities.
Yih-Neng Lee, Kulicke & Soffa's Senior Vice President of Global Sales
and Services, said, "The back-end semiconductor market continues to
evolve rapidly, increasing demand and creativity in the assembly and
packaging technologies. K&S is well positioned to address these new
challenges and continues to invest at the fore-front of technology."
Kulicke & Soffa will be holding a technical seminar during the SEMICON
Taiwan trade show on September 7, 2016, at Nangang Exhibition Hall, 6F,
616 Meeting Room.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and
manufacture of semiconductor, LED and electronic assembly equipment. As
a pioneer in this industry, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, advanced SMT, wedge
bonding and a broader range of expendable tools to its core ball bonding
products. Combined with its extensive expertise in process technology,
K&S is well positioned to help customers meet the challenges of
assembling the next-generation semiconductor and LED devices. (www.kns.com)
View source version on businesswire.com: http://www.businesswire.com/news/home/20160901005122/en/
Kulicke & Soffa Industries, Inc.
Investor Relations & Strategic Initiatives
Source: Kulicke & Soffa Industries, Inc.
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