Kulicke & Soffa Continues to Gain Traction with its Advanced Packaging Solutions
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa",
"K&S" or the "Company"), continues to expand its presence in the
advanced packaging market, through focused feature development and
strategic customer engagement.
K&S has a complete offering of advanced packaging solutions supporting
Fan-Out Wafer Level Packaging (FOWLP), Wafer Level Packaging (WLP), Flip
Chip, System-in-Package (SiP), Package-on-Package (PoP), Embedded Die
and Thermo-Compression Bonding (TCB).
Continuing from the first market acceptance of its APAMA™ solutions in
February this year, K&S recently received a third purchase order from a
global memory manufacturer. In addition, K&S has shipped more than 60
sets of its HYBRID equipment, a multi-application advanced packaging
solution, to a major assembly and test provider supporting premium
smartphone SIP applications.
Tong Liang Cheam, Kulicke & Soffa's Vice President of the Advanced
Packaging Business Line and Corporate Strategy, commented, "Over the
past several years we have aggressively expanded our market presence
which now collectively addresses every high-growth advanced packaging
process. The recent market successes serve as a testament to our
unwavering dedication to support and resolve our customers' most
challenging interconnect requirements."
K&S continues to further its advanced packaging program through ongoing
evaluations, qualifications and its global sampling program with leading
integrated device manufacturers and assembly and test providers.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and
manufacture of semiconductor, LED and electronic assembly equipment. As
a pioneer in this industry, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, advanced SMT, wedge
bonding and a broader range of expendable tools to its core ball bonding
products. Combined with its extensive expertise in process technology,
K&S is well positioned to help customers meet the challenges of
assembling the next-generation semiconductor and LED devices. (www.kns.com)
View source version on businesswire.com: http://www.businesswire.com/news/home/20160803005094/en/
Kulicke & Soffa Industries, Inc.
Investor Relations & Strategic Initiatives
Source: Kulicke & Soffa Industries, Inc.
News Provided by Acquire Media
Close window | Back to top