Kulicke & Soffa Joins Chip-on-Wafer Consortium II
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa",
"K&S" or the "Company"), a global leader in the design and manufacture
of semiconductor and LED assembly equipment, has joined A*STAR's
Institute of Microelectronics (IME)'s Chip-on-Wafer Consortium II,
together with other major industry players. Through this collaboration,
K&S is confident that with the combined experience and knowledge, the
consortium will extend the capabilities of Chip-on-Wafer (CoW) assembly
with low-temperature copper-to-copper bonding for 2.5D and 3D IC
Deepak Sood, Kulicke & Soffa's Vice President of Global Engineering,
said, "As the features and functionalities of ICs increase, growing
demand for reduced pitch and higher I/O count are driving the need for
innovative solutions. Addressing the fundamental challenges to enable
the next generation of fine-pitch 2.5D and 3D devices, at high
throughputs, will create meaningful production value."
Low temperature copper-to-copper bonding is a key enabler to fine-pitch
Chip-on-Wafer bonding ( < 10um copper pillar pitch). Often, the higher
I/O, fine-pitch layout poses inherent challenges for existing production
techniques. Through developments focused on reducing bonding temperature
and force requirements, the consortium is driving solutions for yield
improvements, cost reductions and ultimately broad market adoption.
"We are pleased to welcome K&S as a member in the Chip-on-Wafer
Consortium II. We have worked with K&S for close to two years and
achieved encouraging results in the development of advanced packaging
technology. Our collaboration with valuable industry players such as K&S
is an example of how IME's research capabilities can drive innovation
and help semiconductor companies capture new growth opportunities in the
electronics market. We look forward to our continued collaboration and
helping it to develop new products on flip chip bonding that will meet
emerging market requirements on 2.5D and 3D IC packaging," said Prof.
Dim-Lee Kwong, Executive Director of IME.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and
manufacture of semiconductor, LED and electronic assembly equipment. As
a pioneer in this industry, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, advanced SMT, wedge
bonding and a broader range of expendable tools to its core ball bonding
products. Combined with its extensive expertise in process technology,
K&S is well positioned to help customers meet the challenges of
assembling the next-generation semiconductor and LED devices. (www.kns.com)
View source version on businesswire.com: http://www.businesswire.com/news/home/20160630005080/en/
Kulicke & Soffa Industries, Inc.
& Soffa Industries, Inc.
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Source: Kulicke & Soffa Industries, Inc.
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