Kulicke & Soffa to Participate at PCIM Europe 2016
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa",
"K&S" or the "Company"), announced today that it will be exhibiting at
the PCIM Europe (Power Conversion and Intelligent Motion) 2016 trade
show, international leading exhibition for Power Electronics,
Intelligent Motion, Renewable Energy and Energy Management. The event
will be held in Nuremberg, Germany, from May 10 to 12, 2016.
Kulicke & Soffa will be showcasing its market leading packaging
solutions in Hall 6 booth number 109.
The AsterionTM i-Multi - a compact, multi magazine handler
solution designed and integrated for K&S's latest enhanced capability
hybrid wedge bonder. This integrated solution can be customized to
handle master card direct bonded copper (DBC) substrates, singulated
DBC substrates, modules, flat boat and J-boat carriers.
The Hybrid - the best solution for Hybrid Power Modules and wafer
level packaging, SIP, MCM, FC and Package-on-Package.
The iFlex T2 PoP - its new design features an increase in feeder
capacity, achieving 25% more feeder positions. Combining this
increased feeder capacity, with the high volume and high quality iX
system delivers the Flexline, which offers best-in-class flexibility,
fast changeovers, lower cost-of-ownership and the lowest defect rates.
Chan Pin Chong, Kulicke & Soffa's Vice President for the Wedge Bonders,
Capillaries and Blades Business Lines, said, "PCIM trade show has always
been a valuable platform for us to reach our target customers in Europe
and promote our R&D advancements. Our focus for the show this year is on
interconnect solutions for automotive where K&S has proven solutions in
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and
manufacture of semiconductor, LED and electronic assembly equipment. As
a pioneer in this industry, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, advanced SMT, wedge
bonding and a broader range of expendable tools to its core ball bonding
products. Combined with its extensive expertise in process technology,
K&S is well positioned to help customers meet the challenges of
assembling the next-generation semiconductor and LED devices. (www.kns.com)
View source version on businesswire.com: http://www.businesswire.com/news/home/20160509005116/en/
Kulicke & Soffa Industries, Inc.
& Soffa Industries, Inc.
Relations & Strategic Initiatives
Source: Kulicke & Soffa Industries, Inc.
News Provided by Acquire Media
Close window | Back to top