Kulicke & Soffa to Participate at SMT Hybrid Packaging 2016
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa",
"K&S" or the "Company"), announced today that it will be exhibiting at
the SMT Hybrid Packaging trade show, Europe's leading event on system
integration in microelectronics. The event will be held in Nuremberg,
Germany, from April 26 to 28, 2016.
Kulicke & Soffa will be at the SMT Hybrid Packaging trade show booth
7A-321, showcasing its market leading packaging solutions.
The AsterionTM - a single platform hybrid wedge bonder with
the capability to handle a multitude of interconnect materials
including large and small aluminum wire, copper wire, PowerRibbonTM,
as well as aluminum copper-clad ribbon. In addition, the Asterion's
interconnect bonding technology has recently been extended to battery
The iFlex - its new design features an increase in feeder capacity,
achieving 25% more feeder positions. Combining this increased feeder
capacity, with the high volume and high quality iX system delivers the
Flexline, which offers best-in-class flexibility, fast changeovers,
lower cost-of-ownership and the lowest defect rates.
The Hybrid - a multi-application solution for advanced packaging with
one of the industry's lowest defect rates and highest throughput. It
delivers placement accuracy up to 7µm, making it ideal for wafer level
packaging, Fan-Out Wafer Level Packaging (FOWLP), System-in-Package
(SiP), Multi-chip module (MCM), flip-chip, modules and embedded
components. Having evolved from the high speed AX/iX product family,
the Hybrid is highly capable of placing both active and passive
components with a single platform.
The IConnPS ProCu PLUSTM - a ball bonder
with the new ProCu5 process offering the highest level of Copper
Process Capability available, with added controls and improvements.
ProCu5 enables robust wire bonding production for advanced node wafers
with 28 nanometer or below. In addition, it has the capability to bond
silver alloy wire with ProAg feature and aluminum fine wire with
Please contact your local sales and services representative for more
information on K&S' comprehensive solutions.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and
manufacture of semiconductor, LED and electronic assembly equipment. As
a pioneer in this industry, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, advanced SMT, wedge
bonding and a broader range of expendable tools to its core ball bonding
products. Combined with its extensive expertise in process technology,
K&S is well positioned to help customers meet the challenges of
assembling the next-generation semiconductor and LED devices. (www.kns.com)
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Kulicke & Soffa Industries, Inc.
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Source: Kulicke & Soffa Industries, Inc.
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