July 10, 2017

Kulicke & Soffa to Participate at SEMICON West 2017

SINGAPORE--(BUSINESS WIRE)-- Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S" or the "Company"), announced today that it will be exhibiting at the SEMICON West trade show in San Francisco, California, from July 11 through July 13, 2017.

Kulicke & Soffa will be introducing, a video illustration of its first lithography solution developed specifically for Advanced Packaging. Additionally, K&S will be featuring several of its leading packaging solutions at booth number 5862 of the SEMICON West trade show.

  • AsterionTM EV - is built on an extended architecture of large frame for applications such as battery interconnect wire bonding, dual lane material handling systems and large power modules coupled with a compelling configurable bond head. It also supports a multitude of interconnect applications for both aluminum wire and PowerRibbonTM.
  • IConnPS ProCu PLUSTM - is engineered to handle challenging copper bonding requirement. The ProCu5 process offers the highest level of copper process capability¬†with many added controls and improvements, enabling robust wire bonding production for advanced node wafers down to 28 nanometer or below.
  • Hybrid Wafer Feeder - an innovative solution that enables the combination of ultra-high-speed passive and high-accuracy flip-chip bonding directly from wafer, tape-and-reel or waffle pack. It is ideal for high-volume System-in-Package (SiP), flip-chip, die-attach and wafer-level-packaging manufacturing with placement accuracy up to 7µm @ 3 sigma.

"We are excited to share with customers our first step-and-repeat lithography solution serving the broad-ranging requirements of the Advanced Packaging market. The high-throughput, modular i-line steppers uniquely utilize a laser-light source, driving best-in-class cost-of-ownership," said Gerrit van der Beek, Kulicke & Soffa's Vice President of Lithography Business Lines.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. (www.kns.com)

Kulicke & Soffa Industries, Inc.
Marilyn Sim
Public Relations
P: +65-6880-9309
F: +65-6880-9580
msim@kns.com
or
Kulicke & Soffa Industries, Inc.
Joseph Elgindy
Investor Relations & Strategic Initiatives
P: +1-215-784-7518
F: +1-215-784-6180
investor@kns.com

Source: Kulicke & Soffa Industries, Inc.

News Provided by Acquire Media


Close window | Back to top

Copyright 2017 Kulicke and Soffa Industries, Inc.