Kulicke & Soffa to Participate at IPC APEX EXPO 2017
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa",
"K&S" or the "Company"), announced today that it will be exhibiting at
the IPC APEX EXPO 2017 trade show from February 14 to 16, 2017.
Kulicke & Soffa will be showcasing its market leading packaging
solutions at San Diego Convention Center, Booth Number 3422.
AsterionTM - a single platform hybrid wedge
bonder with the capability to handle a multitude of interconnect
materials including large and small aluminum wire, copper wire, PowerRibbonTM,
as well as aluminum copper-clad ribbon. In addition, the Asterion's
interconnect bonding technology has recently been extended to battery
Hybrid - a multi-application solution for advanced packaging,
ideal for Wafer Level Packaging (WLP), Fan-Out Wafer Level Packaging
(FOWLP), System-in-Package (SiP), Multi-Chip Module (MCM), flip-chip,
modules and embedded components.
iFlex - its new design features an increase in feeder capacity,
achieving 25% more feeder positions. Combining this increased feeder
capacity, with the high volume and high quality iX system delivers the
Flexline, which offers flexibility, fast changeovers, lower
cost-of-ownership and the lowest defect rates. The iFlex H1 is now
available with a different placement head for placing components up to
50mm in height over pre-mounted components of 50mm.
Industry 4.0 - factory connectivity
solution, via intelligent monitoring systems, latest technology
traceability, material management and scheduling intelligence across
our current and future platforms.
Chan Pin Chong, Kulicke & Soffa's Senior Vice President for AP-Hybrid,
Electronics Assembly, Wedge Bonders, Capillaries and Blades Business
Lines, said, "The IPC APEX EXPO has always been a valuable
platform for us to connect with our partners in the Americas. We look
forward to sharing how our wire bonding, electronic assembly and
advanced packaging offerings can solve evolving industry challenges."
Kulicke & Soffa will be holding a technical seminar during the IPC APEX
EXPO 2017 trade show on February 13, 2017, at Hotel del Coronado, San
Please contact your local sales and services representative for more
information on K&S' comprehensive solutions and the seminar.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor
packaging and electronic assembly solutions supporting the global
automotive, consumer, communications, computing and industrial segments.
As a pioneer in the semiconductor space, K&S has provided customers with
market leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, electronics assembly,
wedge bonding and a broader range of expendable tools to its core
offerings. Combined with its extensive expertise in process technology
and focus on development, K&S is well positioned to help customers meet
the challenges of packaging and assembling the next-generation of
electronic devices. (www.kns.com)
View source version on businesswire.com: http://www.businesswire.com/news/home/20170209005107/en/
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