SINGAPORE--(BUSINESS WIRE)--Feb. 26, 2018--
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”,
“K&S” or the “Company”), announced today that it will be exhibiting at
the IPC APEX EXPO 2017 trade show from February 27 to March 1, 2018.
Kulicke & Soffa will be showcasing its market leading packaging
solutions at San Diego Convention Center, Booth Number 3819.
- iFlex T2 – its new design increases feeder capacity by 25%
while also excelling at multi-part tray feeding. This multifunctional
flexibility makes it a perfect standalone or end-of-line solution for
the most demanding, high-mix applications.
- Hybrid Wafer Feeder – an innovative solution that enables the
combination of ultra-high-speed passive and active placement with
high-accuracy flip-chip bonding directly from wafer, ideal for
high-volume System-in-Package (SiP), flip-chip, die-attach and
wafer-level-package manufacturing. Placement accuracy up to 7µm @ 3
sigma, provides a compelling alternative to existing commercial
Chan Pin Chong, Kulicke & Soffa’s Senior Vice President for EA/APMR &
Wedge Bonder Business Units, said, “Driven by increasing automotive
demand, ongoing deployment of connected devices, and the perpetual
growth of global electronic consumption, the semiconductor and
electronic market will continue to evolve increasing assembly complexity
for our customers. Our broadening portfolio, strategic R&D investments
and product development roadmap will continue to provide competitive,
value-additive solutions for this ever-evolving market space.”
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor
packaging and electronic assembly solutions supporting the global
automotive, consumer, communications, computing and industrial segments.
As a pioneer in the semiconductor space, K&S has provided customers with
market leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, electronics assembly,
wedge bonding and a broader range of expendable tools to its core
offerings. Combined with its extensive expertise in process technology
and focus on development, K&S is well positioned to help customers meet
the challenges of packaging and assembling the next-generation of
electronic devices. (www.kns.com)
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Source: Kulicke & Soffa Industries, Inc.
Kulicke & Soffa Industries, Inc.
Investor Relations & Strategic Initiatives