Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa",
"K&S" or the "Company") announced today its collaboration agreement with
Kinik Company, to provide comprehensive dicing blades solutions.
This sales and distribution agreement enhances both organizations'
complementary product offerings within select markets. Kulicke & Soffa's
electro-plated dicing blades target silicon wafer and non-metalized
package singulation, while Kinik's molded dicing blades focus on
metalized packages and hard-material substrate singulation applications.
This initial collaboration partnership establishes a foundation for more
meaningful joint development opportunities in the future.
"This is a perfect match for K&S and Kinik to provide customers with a
complementary portfolio of dicing blades products," said Eugene Tan,
Kulicke & Soffa's Senior Director of Capillary and Blade Business Lines.
"We look forward to enhancing this partnership in the future."
William Lee, Kinik's General Manager and Head of Diamond Business Unit
said, "This collaboration is an important step in our commitment to
better support our customers. Together, with our aligned market-driven
strategy, we will provide a broad range of competitive dicing blades
solutions to customers."
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor
packaging and electronic assembly solutions supporting the global
automotive, consumer, communications, computing and industrial segments.
As a pioneer in the semiconductor space, K&S has provided customers with
market leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, electronics assembly,
wedge bonding and a broader range of expendable tools to its core
offerings. Combined with its extensive expertise in process technology
and focus on development, K&S is well positioned to help customers meet
the challenges of packaging and assembling the next-generation of
electronic devices (www.kns.com).
For over 60 years, the Kinik Company (TT: 1560) has been an innovator
and leader in diamond and super-abrasive technology. With revenues of
over $145 million, Kinik supplies more than 8,000 customers worldwide
with products ranging from all kinds of grinding wheels, hubless dicing
blades, polycrystalline diamond (PCD) and polycrystalline boron-nitride
(PCBN) precision machining tools to CMP pad conditioners and
semiconductor reclaim wafer services. Kinik maintains 4 manufacturing
facilities in Taiwan, including the latest state-of-the-art CMP Pad
Conditioner Manufacturing Facility in Shulin, with more than 1,600
employees. Kinik is committed to the highest standards Environmental,
Health & Safety and is SGS certified for OHSAS 180001, ISO 9001 and
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Kulicke & Soffa Industries, Inc.
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Source: Kulicke & Soffa Industries, Inc.
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